BEGIN:VCALENDAR VERSION:2.0 METHOD:PUBLISH PRODID:-//Missouri State University/Calendar of Events//EN CALSCALE:GREGORIAN X-WR-TIMEZONE:America/Chicago BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT TZOFFSETFROM:-0600 TZOFFSETTO:-0500 DTSTART:20070311T020000 RRULE:FREQ=YEARLY;BYMONTH=3;BYDAY=2SU TZNAME:CDT END:DAYLIGHT BEGIN:STANDARD TZOFFSETFROM:-0500 TZOFFSETTO:-0600 DTSTART:20071104T020000 RRULE:FREQ=YEARLY;BYMONTH=11;BYDAY=1SU TZNAME:CST END:STANDARD END:VTIMEZONE BEGIN:VEVENT UID:a0ca4166-cc17-4938-a6c4-7215d41265f3.218528@calendar.missouristate.edu CREATED:20211101T170609Z LAST-MODIFIED:20211101T170609Z LOCATION: SUMMARY:PAMS Seminar: "Bioinspired Evaporative Cooling for High Heat Flux Applications" by Dr. Damena Agonafer DESCRIPTION:Dr. Damena AgonaferDepartment of Mechanical Engineering & Mate rials ScienceWashington University in St. Louis\n\n\nAbstract:The demand for data centers and corresponding power requirements continues to rise p ushing 2% of the annual electricity use in the US. The need for internet access for a variety of requirements including for online education has n ot been more pronounced than during the COVID-19 pandemic the world is fa cing now. The failure of voltage scaling with transistor gate scaling sin ce the mid-2000s has resulted in the failure of Dennardian scaling result ing in increased power density with new technology nodes. To limit the ch ip power\, with every new generation of transistors\, an increasing part of the silicon remains inactive or dark limiting the performance of the p rocessors. In addition\, the recent emphasis on applications such as arti ficial intelligence and data mining is pushing the power limits of GPUs a nd CPUs used on data center servers. The next generation of high-powered micro- and power electronic devices will require advanced thermal managem ent solutions for dissipating large heat fluxes that will soon exceed 1 k W/cm2. The performance of state-of-art cooling technologies are lagging t he maximum heat dissipation requirements due to either inherent limits of physics or technical constraints (e.g.\, high operating pressures). Such high heat dissipation requires aggressive cooling strategies for ensurin g reliable performance of these electronic components. Two-phase cooling technologies\, such as microscale evaporation\, are of growing interest f or electronics cooling due to their high heat removal capacity. In this t alk\, I will identify the key mechanisms of microscale evaporation and ad dress how geometrical features from microstructures and surface nanocoati ngs affect contact line dynamics\, thermocapillary flow\, and interfacial transport during the different stages of the evaporation process.\n\n\nT his seminar will be held exclusively on Zoom (955 5209 1021). Please visi t the Physics Seminars page for a link. X-ALT-DESC;FMTTYPE=text/html:<html><head><title></title></head><body><p><b >Dr. Damena Agonafer</b><br><b>Department of Mechanical Engineering &amp\ ; Materials Science</b><br><b>Washington University in St. Louis</b></p>\ n<p>Abstract:<br>The demand for data centers and corresponding power requ irements continues to rise pushing 2% of the annual electricity use in th e US. The need for internet access for a variety of requirements includin g for online education has not been more pronounced than during the COVID -19 pandemic the world is facing now. The failure of voltage scaling with transistor gate scaling since the mid-2000s has resulted in the failure of Dennardian scaling resulting in increased power density with new techn ology nodes. To limit the chip power\, with every new generation of trans istors\, an increasing part of the silicon remains inactive or dark limit ing the performance of the processors. In addition\, the recent emphasis on applications such as artificial intelligence and data mining is pushin g the power limits of GPUs and CPUs used on data center servers. The next generation of high-powered micro- and power electronic devices will requ ire advanced thermal management solutions for dissipating large heat flux es that will soon exceed 1 kW/cm2. The performance of state-of-art coolin g technologies are lagging the maximum heat dissipation requirements due to either inherent limits of physics or technical constraints (e.g.\, hig h operating pressures). Such high heat dissipation requires aggressive co oling strategies for ensuring reliable performance of these electronic co mponents. Two-phase cooling technologies\, such as microscale evaporation \, are of growing interest for electronics cooling due to their high heat removal capacity. In this talk\, I will identify the key mechanisms of m icroscale evaporation and address how geometrical features from microstru ctures and surface nanocoatings affect contact line dynamics\, thermocapi llary flow\, and interfacial transport during the different stages of the evaporation process.</p>\n<p>This seminar will be held exclusively on Zo om (955 5209 1021). Please visit the&nbsp\;<a href="https://physics.misso uristate.edu/seminars.htm">Physics Seminars page</a> for a link.</p></bod y></html> DTSTART;TZID=America/Chicago:20211118T160000 DTEND;TZID=America/Chicago:20211118T170000 SEQUENCE:0 URL:https://physics.missouristate.edu/seminars.htm CATEGORIES:Public,Alumni,Current Students,Faculty,Future Students,Staff END:VEVENT END:VCALENDAR